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. Author manuscript; available in PMC: 2014 Mar 21.
Published in final edited form as: Lab Chip. 2013 Mar 21;13(6):1102–1108. doi: 10.1039/c2lc41057e

Fig. 1.

Fig. 1

Overview of the pen microfluidics fabrication process. (a) An ink mask is drawn on a COC chip surface. (b) Vapor-phase solvent exposure results in patterned growth of the COC surface by solvent swelling. (b) Bonding is realized by bringing the patterned surface into contact with a sealing layer, followed by solvent bonding using a desktop laminator. (d) The water-soluble ink masking layer remaining within the sealed microchannel is removed by pumping aqueous buffer through the channel.