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. Author manuscript; available in PMC: 2014 Mar 21.
Published in final edited form as: Lab Chip. 2013 Mar 21;13(6):1102–1108. doi: 10.1039/c2lc41057e

Fig. 4.

Fig. 4

Cross-sectional views of channels fabricated using (a) 8 min, (b) 30 min, and (c) 60 min solvent exposure times, resulting in channel heights of 8 µm, 29 µm, and 61 µm, respectively. In case (a), chip bonding was performed using a hot press, while in cases (b) and (c) a low-pressure lamination process was used for bonding to minimize channel height reduction.