Fig. 3.

Parallel droplet heating of multiple constructs. (A) A sequence of images showing the process of heating of linked devices for plots B and C. Each droplet contains a unique FRET construct with a different melting temperature (50, 61, and 80 °C). (B) A plot of the raw fluorescence data from the droplets during the voltage sweep. (C) The derivative of B provides the melting voltage for each of the constructs. SI Appendix,Table S3 provides averages and SDs for melting curves performed on multiple devices and chips. D and E provide a second example of linked device heating. In this example, it is possible to discern between two fully complementary strands and a heteroduplex that contains a single base mismatch. SI Appendix, Table S4 provides average and SDs for the melting voltage across multiple chips.