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. Author manuscript; available in PMC: 2013 Jun 5.
Published in final edited form as: Sens Actuators B Chem. 2010 Feb 4;145(2):807–816. doi: 10.1016/j.snb.2010.01.063

Fig. 5.

Fig. 5

Photograph of topside of a solid diaphragm sensor assembly with hydrogel inserted and mounted to a perforated backing plate (out of view). Wire bonding was performed using gold insulated wire (d = 50 μm). The entire assembly, wires, and PCB are ready for parylene deposition.