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. 2008 Jul 29;8(7):4466–4486. doi: 10.3390/s8074466

Figure 6.

Figure 6.

Surface stress change during exposure of Cu(001) to oxygen at 300 K (blue curve) and 500 K (red curve). The resulting LEED patterns (E = 115 eV) after oxygen exposure show the diffraction pattern of the missing row (2×22)R45° structure (upper image) and the c(2 × 2) structure (lower image). Exposure to O2 was performed at a partial pressure of order 10−6 mbar, and it is given in Langmuir (1 L = 10−6 torr s).