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. 2013 Jul 23;4:2202. doi: 10.1038/ncomms3202

Figure 3. Mechanistic analysis of CNT–Cu composite.

Figure 3

(a) Variation of resistivity with time for CNT–Cu composite at a current density of 720 MA cm−2 at 473 K. (b) Experiment in a repeated at different temperatures to give an Arrhenius plot of ln(time-to-failure) versus 1/kBT. The activation energy for Cu diffusion in CNT–Cu is determined from the slope of this graph. (c) Comparison of Lorentz number for CNT–Cu (red) with Cu (black) as a function of temperature, indicating an increasing phonon contribution of CNT with temperature in CNT–Cu composite.