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. 2013 Oct 10;3:2917. doi: 10.1038/srep02917

Figure 1. Debond growth behaviors of the Ni-SiO2 interface.

Figure 1

(a) Debond growth rate (da/dt) as a function of the debond driving energy (G) for the Ni-SiO2 interface in water (blue squares) and in air with a 20% relative humidity (red triangles) at 21°C. Inset schematic shows the double-cantilever-beam specimen geometry used for the measurements. (b) Optical inspection of defects for the delaminated surfaces after the debond test in water (left) and in air (right).