Fig. 5.
Comparison of Bi films electrodeposited by controlled-current (5 mA/cm2) and controlled-potential (−0.8 V). SEM images of the (a) Au seed layer, (b) controlled current Bi film, and c controlled potential Bi film illustrate surface quality. AFM scans of the (d) Au seed layer, (e) controlled current Bi film, and (f) controlled potential Bi film illustrate surface roughness. Controlled current electrodeposition method exhibited a lower film deposition rate (g) as compared with the controlled potential condition (h). Film thickness was measured over a 1 cm2 area using profilometery