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. Author manuscript; available in PMC: 2013 Dec 1.
Published in final edited form as: Methods. 2013 Jun 29;64(2):10.1016/j.ymeth.2013.06.019. doi: 10.1016/j.ymeth.2013.06.019

Table 1.

Comparison of the fabrication specifications between the previous reported device and the NanoVelcro CTC Chip

Previous device NanoVelcro CTC Chip
PDMS mold Su-8 structures on silicon wafer Dry etched silicon wafer
Channel length 88 cm 22 cm
SNP configuration Serpentine line Disconnected straight lines