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. Author manuscript; available in PMC: 2014 Jan 13.
Published in final edited form as: J Microelectromech Syst. 2012 Apr 10;21(4):882–896. doi: 10.1109/JMEMS.2012.2190712

Fig. 19.

Fig. 19

(a) Failed sample failure on the base die showing three kinds of failures. (b) Failed sample on the second die showing one type of failure at the interface between Ag bump and the joined Si bare die surface (not shown).