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. Author manuscript; available in PMC: 2014 Jan 13.
Published in final edited form as: J Microelectromech Syst. 2012 Apr 10;21(4):882–896. doi: 10.1109/JMEMS.2012.2190712

Fig. 5.

Fig. 5

SEM picture showing Ag epoxy bump interconnect on MEMS movable microelectrodes with (a) chevron microactuators, (b) linear actuator, and (c) linear actuators with a gear.