Skip to main content
. Author manuscript; available in PMC: 2014 Jan 13.
Published in final edited form as: J Microelectromech Syst. 2012 Apr 10;21(4):882–896. doi: 10.1109/JMEMS.2012.2190712

Fig. 8.

Fig. 8

Comparison of the flip-chip and wire-bonding packages. (A) Previous wire-bonding package. (B) MEMS die flip chipped on a glass substrate (reported in this study). (C) Chip-scale flip-chip package. (D) Chip-scale flip chip with flexible Parylene-C interconnects.