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. Author manuscript; available in PMC: 2014 Jan 13.
Published in final edited form as: J Microelectromech Syst. 2012 Jul 13;21(5):1172–1186. doi: 10.1109/JMEMS.2012.2203789

Fig. 2.

Fig. 2

(a) CAD diagram of the new generation of MEMS microelectrode device with an array of three microelectrodes actuated by Chevron-peg microactuators. The microelectrodes are electrically connected to the recording bond pad via spring type leads. (b) CAD diagram showing an enlarged image of the microelectrode actuated by the Chevron-peg type of actuation mechanism with a pair of disengage and drive actuators placed opposed to each other. (c) SEM image of microelectrode actuated by Chevron-peg type of actuation. The microelectrode has maximum displacement of 5 mm in steps of about 6.5 μm. The inset shows the encircled region which is the contact between the pawl/peg and a single row of teeth on the microelectrode.