Skip to main content
. Author manuscript; available in PMC: 2014 Jan 28.
Published in final edited form as: IEEE Trans Biomed Circuits Syst. 2013 Apr;7(2):115–128. doi: 10.1109/TBCAS.2013.2255874

Fig. 2.

Fig. 2

SolidWorks (Waltham, MA, USA) model exploded view of the hermetically packaged 100-Ch fully implantable wireless neurosensing device.