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. Author manuscript; available in PMC: 2014 Feb 4.
Published in final edited form as: J Microelectromech Syst. 2011 Nov 3;21(1):132–144. doi: 10.1109/JMEMS.2011.2171326

Fig. 11.

Fig. 11

Micrographs (a) Ag epoxy bumps of increasing heights after successive dispensing steps and (b) showing the Ag epoxy bumps after four dispensing steps.