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. Author manuscript; available in PMC: 2014 Feb 4.
Published in final edited form as: J Microelectromech Syst. 2011 Nov 3;21(1):132–144. doi: 10.1109/JMEMS.2011.2171326

Fig. 18.

Fig. 18

Flux residue from the normal reflow process freezes the MEMS active part; the flux leaks from the perimeter of the pad to the active part during reflow process. This contamination is uncontrollable and causes the yield of bumping process to be significantly reduced.