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. Author manuscript; available in PMC: 2014 Feb 4.
Published in final edited form as: J Microelectromech Syst. 2011 Nov 3;21(1):132–144. doi: 10.1109/JMEMS.2011.2171326

Fig. 21.

Fig. 21

Glass with eight Ag epoxy bump interconnects after shear stress test. Prior to the shear test, it was flip chipped on silicon chips with aluminum bond pads. The seven bumps shown in broken circles showed failure at the polysilicon pad–silicon die interface.