Figure 2. Fabrication process for out-of-plane crimped collagen fiber networks.
(a) Silicon dioxide and photoresist patterning on a silicon wafer. (b) ICP etching of silicon. (c) Photoresist removal and ICP etching. (d) KOH etching of silicon for etching the bridges yielding a reentrant multi-depth template. (e) Collagen spray coating. (d) Out-of-plane crimped collagen microfiber network on a water-soluble tape.