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. Author manuscript; available in PMC: 2014 Apr 8.
Published in final edited form as: Sens Actuators A Phys. 2012 Dec 1;188:312–319. doi: 10.1016/j.sna.2011.12.044

Figure 2.

Figure 2

An illustration of the molding procedure of 4% agar microchannels. (a) Spin coated SU-8 photoresist (thickness: 500 μm) is exposed to UV light through a photomask. (b) Development produces a SU-8 mold. (c) Four percent molten agar is pour over the SU-8 mold and cured at room temperature for 10-15 minutes. (d) The solidified 4% agar microchip is then peeled off from the mold.