Table 2.

Summary of apparent activation energies and associated failure mechanisms comparing Au and PdCu ball bonds used in semiconductor device

Ball bond type	HTSL aging test conditions (°C)	Eaa (eV)	Failure mechanism	Reference
Au	N/A	1.00–1.26	Kirkendall void	[11]
Cu	N/A	0.75	CuAl corrosion	[11]
Cu	150, 175, 200	0.70	CuAl microcrack	[12]
PdCu	150, 175, 200	0.85	CuAl microcrack	This work
Au	150, 175, 200	1.10	Kirkendall void