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. 2014 May 8;8(3):034101. doi: 10.1063/1.4875656

Figure 3.

Figure 3

The process flow for the integration of the heater and the temperature sensor on the thin film chamber. (a) The SixNy film is etched by reactive ion etching, (b) the silicon dioxide is etched with BOE isotropic wet etching, and (c) the poly etch is used to isotropically undercut the silicon.