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. Author manuscript; available in PMC: 2015 Oct 31.
Published in final edited form as: Sens Actuators B Chem. 2014 Oct 31;202:866–872. doi: 10.1016/j.snb.2014.06.023

Fig. 3.

Fig. 3

SEM image of a typical monolith-COC interface in a reintegrated monolith chip. Mechanical interlocking of the materials occurs as the porous monolith is pressed into the solvent-softened bulk thermoplastic substrate.