Skip to main content
. Author manuscript; available in PMC: 2014 Aug 4.
Published in final edited form as: Lab Chip. 2012 Mar 21;12(10):1865–1873. doi: 10.1039/c2lc21146g

Figure 1.

Figure 1

Schematic of the fabrication process for the μPAC device. The μPAC device was fabricated using a soft-lithography compatible fabrication technique, and it contained a rectangular microfluidic channel embedded with a hexagonally arranged PDMS micropost array on the bottom surface of the microfluidic channel. Using microcontact printing, the tops of the PDMS microposts were selectively coated with adhesive ECM proteins for cell seeding.

HHS Vulnerability Disclosure