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. 2014 Jul 26;9(1):366. doi: 10.1186/1556-276X-9-366

Figure 2.

Figure 2

Schematic view of via-hole device and OM image. (a) Schematic view of the Cu pillar formation and memory characteristics of an Al/Cu/Al2O3/TiN structure. (b) Optical image (OM) of a typical 4 × 4 μm2 device. The ‘V4.0’ as indicated on OM image is via size of 4 × 4 μm2.