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. 2014 Aug 19;4:6123. doi: 10.1038/srep06123

Figure 1.

Figure 1

Microstructure analysis for the two Cu seed layers in this study: (a) Plan-view TEM image for the strong <111>-oriented seed layer. (b) The corresponding SAD of the grains in (a). (c) Plan-view EBSD orientation image map of the strong <111>-oriented seed layer. (d) Plan-view TEM image for the regular <111>-oriented seed layer. (e) The corresponding SAD of the grains in (d). (f) Plan-view EBSD orientation image map of the regular <111>-oriented seed layer.