Skip to main content
. 2014 Aug 29;4:6230. doi: 10.1038/srep06230

Figure 1.

Figure 1

(a) X-ray diffraction (XRD) patterns, (b) The full width at half maximum for Cu (111) peak and (c) electrical resistivity of Cu thin films as a function of deposition temperature and target type. “Cu” represents the thin films fabricated using a commercial Cu target. “SCu” represents thin films produced using a single-crystal Cu target grown via the Czochralski method.