Figure 10.

(a) Surface topography and normalized resistance of a wrinkly wire in a stretch test. Reproduced with permission from [21]; published by Elsevier, 2010. (b) SEM micrographs of wrinkly (left top) and flat (middle top) gold layers. The sample on the left is macroscopically buckled and that on the middle is flat. The buckled sample (left down) is continuous and has a grain-like structure, and the flat sample (middle down) surface presents a network of randomly arranged micro-cracks. Reproduced with permission from [20]; published by Elsevier, 2004. The different behaviors of pre-strained wire and straight wire in stretch test. Reproduced with permission from [29]; published by IEEE, 2004. (c) Stretchable silicon integrated circuits and the mechanical behaviors under 8.8% of tensile strain. Reproduced with permission from [34]; published by AAAS, 2008.