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. 2014 Nov 24;4:7178. doi: 10.1038/srep07178

Figure 3. XPS depth profile of remaining substrate after naturally and mechanically stripping: XPS spectrum of (a) O in MS, (b) Ti in MS, (c) O in NS, (d) Ti in NS.

Figure 3

Ar+ sputtering etched every specimens seven times for 2 min at a time (sputtering etch rate approximately 5 nm/min32).