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. Author manuscript; available in PMC: 2016 Jan 7.
Published in final edited form as: Lab Chip. 2015 Jan 7;15(1):62–66. doi: 10.1039/c4lc00927d

Figure 1.

Figure 1

Assembly of a vacuum bag for device bonding. (a) Cleaned substrate layers are oriented and aligned. The aligned substrate layers are placed on top of a glass slide on the backing plate and covered with a layer of Mylar film (as a sacrificial layer). (b) The layers are covered by a sheet of flexible bagging film. (c) The bagging film is secured to the backing plate using vacuum sealant tape. (d) Vacuum is applied to the completed bag through the vacuum port, creating a distributed load across the entire surface of the vacuum bag. The whole assembly is then baked under vacuum.