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. 2014 Dec 10;14(12):23781–23802. doi: 10.3390/s141223781

Table 2.

Etch and passivation parameters used in the fabrication of the microfluidic channels.

Etch Cycle Passivate Cycle
SF6 Flow Rate 100 sccm 0 sccm
C4F8 Flow Rate 0 sccm 85 sccm
Duration 12 s 5 s
13.56 MHz Platen Power 800 W 600 W
RF Coil Power 600 W 600 W