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. Author manuscript; available in PMC: 2016 Feb 21.
Published in final edited form as: Lab Chip. 2015 Feb 21;15(4):1038–1049. doi: 10.1039/c4lc01254b

Figure 1.

Figure 1

(a) Schematic of the protocol used for assembly of the hybrid-based fluidic devices and the thermal press instrument. (b) Temperature-pressure process profile showing the six stages for the thermal fusion bonding cycle. See main text for a description of the 6 stages of bonding.