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. Author manuscript; available in PMC: 2016 Feb 21.
Published in final edited form as: Lab Chip. 2015 Feb 21;15(4):1038–1049. doi: 10.1039/c4lc01254b

Figure 3.

Figure 3

Variation of the bond strength with (a) temperature, (b) bonding time, and (c) pressure for the hybrid assembly scheme. The data points with the asterisks represent devices that were unusable due to the following reasons; delamination of the cover plates in the devices bonded at 50°C, refilling of the nanochannels by cover plate material in devices bonded at 80°C and irreproducibility of the experimental results as a result of nanochannel deformation or cover plate sagging in the devices bonded at high bonding time (20 min) and high bonding pressure (720 kN/m2).