. Author manuscript; available in PMC: 2016 Feb 21.

Published in final edited form as: Lab Chip. 2015 Feb 21;15(4):1038–1049. doi: 10.1039/c4lc01254b

Table 1.

A summary of the bond strengths for devices assembled with different substrates and cover plates. (U – untreated; PL – plasma treated and the material in parentheses is the cover plate). The number in [] is the assembly temperature used for that particular device.

Number	Assembled device	Bond Strength (mJ/cm²)

1	U-COC/(PL-COC)	0.14 ±0.07
2	PL-COC/(PL-COC)	1.03 ±0.01
3	U-PMMA/(PL-COC)	66 ±7
4	PL-PMMA/(PL-COC)	67 ±7
5	PL-PMMA/(PL-PMMA) [80°C]	1.24 ±0.01
6	U-PMMA/(U-PMMA) [106°C]	1.90 ±0.05