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. 2015 Apr 18;10:188. doi: 10.1186/s11671-015-0880-9

Figure 4.

Figure 4

TEM image of an Al/Cu/Ti/TaOx/W structure. (a) HRTEM images of the (b) outside and (c) inside of the via-hole device, as shown in (a). After deposition of a Ti nanolayer, it became TiO2 [29].