TABLE 1. Similar Exposure Groups for Normal Operations Operators and Maintenance Workers, Separately.

Line C	Lines D and A
Assembly—Backlap	Chemical–Mechanical Planarization
Assembly—Die Attach	Chemical Vapor Deposition
Assembly—Plasma	Clean*
Assembly—Sawing	Diffusion
Assembly—Wire Bonding	Etch
Chemical Support	Implantation
Laboratory	Photo†
Packaging—Marking	Thin-Films Metal
Packaging—Molding
Packaging—Solder Ball Attach/Stack
Packaging—Tin Plating
Packaging—Trim Sort Form
Test—Marking Visual Packing
Test—Monitor Burn-in Testing
Test—Testing

*Also termed Wet Etch.

†Also termed Photolithography.