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. 2015 Jun 17;5:10983. doi: 10.1038/srep10983

Figure 1.

Figure 1

a) Illustration of the fabrication process. I, photolithography process; II, GO reduction; III, washing and cleaning; IV, electrolyte infiltration. The inset represents the cross-section sketch of the metal interdigit. (b) Optical images of the device before (left) and after (right) rGO assembling and air-drying. Inset: the illustration of the substrate patterned with metal interdigit.