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. Author manuscript; available in PMC: 2015 Jun 22.
Published in final edited form as: J Occup Environ Hyg. 2013;10(12):723–733. doi: 10.1080/15459624.2013.836279

TABLE III.

Indium Air Concentrations for Two Copper Indium Gallium Diselenide (CIGS) and One Amorphous Silicon (a-Si) Photovoltaic Companies

Type Job/Task or Area Reported Controls Data Source Year Indium Source Dur. (min) Air Vol. (L) Mass (μg) Air Conc. (mg/m3) RL (μg)
COMPANY 3 (CIGS)
P Clean sputter chamber, grinding LEV hood for parts cleaning NIOSH 2010 ITO 122 374.4 260 0.69 0.3
P Clean sputter chamber, grinding HEPA vacuum NIOSH 2010 ITO 291 859.6 62 0.072 0.3
COMPANY 4 (CIGS)
P Operate roll coater Comp. 2008 CIG 420 858 NP < 0.012 NP
P Operate roll coater Comp. 2008 CIG 384 753 NP < 0.013 NP
P Clean chamber, scraping, Scotch-Brite pads Comp. 2008 CIG 430 867 NP < 0.012 NP
P Clean chamber, scraping, Scotch-Brite pads Comp. 2008 CIG 435 948 NP < 0.011 NP
A Near chamber Comp. 2008 CIG 455 946 NP < 0.013A NP
A Computer work station Comp. 2008 CIG 472 927 NP < 0.021 NP
P Clean chamber, scraping, chiseling Tent enclosure, HEPA vacuum Comp. 2010 CIG 270 447 22 0.049 0.06
P Clean chamber, scraping, chiseling Tent enclosure, HEPA vacuum Comp. 2010 CIG 270 432 26 0.061 0.06
A Inside chamber tent enclosure during cleaning Comp. 2010 CIG 380 652 3.9 0.006 0.06
A Perimeter walkway Comp. 2010 CIG 375 619 0.16 0.00026 0.06
A Entrance to tent enclosure Comp. 2010 CIG 315 538 0.12 0.00022 0.06
A Behind chamber Comp. 2010 CIG 375 608 0.073 0.00012 0.06
A Near slitter and conveyor Comp. 2010 CIG 487 931 0.74 0.0008 0.06
A Between conveyors Comp. 2010 CIG 487 980 0.43 0.0004 0.06
A Below slitter tool Comp. 2010 CIG 487 969 0.62 0.0006 0.06
A Workstation Comp. 2010 CIG 466 936 0.28 0.0003 0.06
COMPANY 5 (a-Si)
P Clean sputter chamber, hand sanded target with abrasive screen, hand scraper on shields Non-HEPA vacuum Comp. 2011 ITO 31 62.3 9.8 0.16 0.1
P “Sandblast” 3 shields Canopy hood, dust collection system vented into blasting room Comp. 2011 ITO 231 464.5 110 0.24 0.1
P Clean sputter chamber, hand scraper on inside surfaces, wire brush to clean target Non-HEPA vacuum Comp. 2011 ITO 23 47.3 15 0.32 0.1
P Clean evaporation chamber, hand scraper on inside surfaces and on a screen Non-HEPA vacuum Comp. 2011 ITO 97 178 970 5.4 0.1
P Clean same evaporation chamber as above Hand scraper attached to HEPA vacuum Comp. 2011 ITO 53 108.8 31 0.28 0.1
A

Computational error in company data corrected.

A = area sample; a-Si = amorphous silicon; CIG = copper indium gallium; Comp. = Company; Conc. = concentration; Dur. = duration; ITO = indium tin oxide; LEV = local exhaust ventilation; NP = information not provided; P = personal sample; RL = reporting Limit; Vol. = volume.