TABLE V.

Major Manufacturing Eras at the Facility (1969–2002)

Era	Major Chemical Processes	Key Process Changes
1969–1973	Raw circuit board manufacture, internal circuitize, external circuitize	NAA
1974–1985	Raw circuit board manufacture, internal circuitize, external circuitize, substrates-MC/cermet resistor operations	Start of substrate manufacture in 1974. Use of trichloroethylene was reduced during the era, with manufacturing use ending in 1985. Conversion to aqueous processing systems for advanced panel circuitize by 1986.
1986–1993	Raw circuit board manufacture, internal circuitize, external circuitize, substrates-MC/cermet resistor operations	Process use of chlorinated solvents including perchlorooethylene continued to be reduced during the era. Use of trichlorotrifluoroethane and methylene chloride was eliminated in panel solvent degreasing by 1994.
1994–1999	Raw circuit board manufacture, internal circuitize, external circuitize, substrates-MC/cermet resistor operations	Substrates-MC/cermet resistor operations and accompanying use of aromatic hydrocarbons gradually reduced, ending by 2000.
2000–2002	Raw circuit board manufacture, internal circuitize, external circuitize	NAA

^ANA = No key process changes applicable.