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. 2015 Aug 18;5:13145. doi: 10.1038/srep13145

Figure 5. Boiling enhancement and the effect of Bond number.

Figure 5

Experimental results showing the percent increase in (a) critical heat flux (CHF), and (b) heat transfer coefficient (HTC) for bi-conductive surfaces as compared to bare copper surfaces. Optimal performance is seen at Bond numbers of unity with a 2x increase in CHF and a 5x increase in HTC. These results highlights the importance of tuning the wavelength of spatial temperature variations, P, with the capillary length of the working fluid, λC, resulting in enhanced boiling performance over all stages of boiling.