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. Author manuscript; available in PMC: 2015 Oct 6.
Published in final edited form as: Sens Actuators B Chem. 2013 Nov 1;188:1055–1063. doi: 10.1016/j.snb.2013.08.018

Fig. 2.

Fig. 2

Micropost array fabrication process, a) after photolithography and patterning circles which corresponds to post diameter, b) after deep Si etching to create Si mold with high aspect ratio, c) after pouring and curing PDMS, d) after peeling off cured PDMS from the mold.