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. 2015 Sep 26;71(Pt 10):1987–1997. doi: 10.1107/S1399004715015011

Figure 1.

Figure 1

Three-layer device layout. (a) Schematic representation of chip layers. (b) Cut-away view of the imaging chamber of the assembled chip with a 150 nm thick silicon nitride window, 15 µm thick photoresist and 8 µm thick Kapton film layer. (c) 100 mm diameter wafer patterned with 24 5 × 30 mm devices. (d) Photograph of a single 5 × 30 mm device (silicon nitride layer only).