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. 2015 Oct 23;5:15466. doi: 10.1038/srep15466

Figure 5. Fabrication process flow along A–A’.

Figure 5

(a) Groove formation. (b) Anodic bonding of a glass wafer and thermal reflow. (c) Removal of the unwanted glass and deposition of an insulation layer. (d) Signal line and microelectrode array patterning. (e) SU-8 waveguide patterning. (f) Release.