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. 2015 Nov 16;5:16537. doi: 10.1038/srep16537

Figure 9. The REWOD chip fabrication process.

Figure 9

(a) shows the 10 mm × 10 mm quartz substrate with a laser drilled hole in the center, (b) sputter deposition of tantalum on front and back side which electrically bridges the center hole, (c) anodization of tantalum film in citric acid, and (d) cytop spin-coated on tantalum pentoxide.