Fig. 4.
Modulated DSC analyses of E1-containing adhesives cured in presence/absence of water, cured in the presence of different weight content of E1. The traces of reversible heat flow and nonreversible heat flow are in (A and B) and derivative reversible heat flow in (C and D). D2O content in E1-25-D2O and E1-50-D2O formulations was 6.8 and 4.1 wt %, respectively.
