Fig. 8.

Comparison of the storage modulus versus temperature curves for experimental adhesives with and without D₂O (A) with those of the control adhesive (C0). DMA (TA instruments, Q800) with a three-point bending clamp was conducted over a temperature range of 0 to 250 °C with a ramping rate of 3 °C/min at a frequency of 1 Hz. Representative tan δ versus temperature curves were shown in (B). The intensity (height) of the tan δ peak reflects the extent of mobility of polymer chain segments at this temperature. The derivative storage modulus versus temperature curves were shown in (C). Symbols: E2-25 means the weight contents of epoxy monomer (E2) in the resin mixture was 25 wt %. D₂O content in E2-25-D₂O formulation was 8.7 wt %.