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. 2015 Dec 14;5:18150. doi: 10.1038/srep18150

Figure 1. Schematic of the droplet analysis using the cryo-FIB/SEM system.

Figure 1

(a) Substrate engineering by Cu deposition on the patterned/non-patterned polymer substrate. (b) Generation of the sessile droplet on the engineered Cu substrate. (c) Rapid slush freezing of the droplet and consequent Pt sputtering under a cryogenic temperature. (d) Electron and gallium ion beam integrated milling and imaging of the droplet under a cryogenic temperature. (e) Wettability analysis of the FIB-milled droplets.