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. 2016 Jan 22;6:19717. doi: 10.1038/srep19717

Table 1. Process conditions used in numerical calculations.

Parameter Set Laser power (W) Beam radius (mm) Scanning speed (mm/s) Layer thickness (mm) Substrate thickness (mm)
1 190 0.5 12.5 0.38 4
2 600 0.5 7.5 0.25 7
3 1000 0.5 12.5 0.38 4