Volumetric thermal expansion coefficient, β
|
θ−1
|
Temperature gradient, ΔT = TP−TS, where TP and TS refer respectively to peak and surrounding temperature |
θ |
Deposition layer thickness, h
|
L |
Thermal diffusivity, , where k, ρ and CP are thermal conductivity, density and specific heat, respectively of deposit material |
L2T−1
|
Heat input per unit length, , where η, P, and v refer to absorption coefficient, beam power and scanning speed, respectively |
MLT−2
|
Melt pool volume, V
|
L3
|
Flexural rigidity of the substrate plate, EI, where E and I refer respectively to elastic modulus and second moment of inertia |
ML3T−2
|
Thermal strain parameter, ε*
|
M0L0T0θ0
|