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. Author manuscript; available in PMC: 2016 Mar 2.
Published in final edited form as: Chem Soc Rev. 2011 Mar 25;40(7):3677–3702. doi: 10.1039/c0cs00138d

Fig. 8.

Fig. 8

AFM profiles measured for (a) PMMA and (b) COC nanoslits (7 μm wide, ~100 nm deep, 12 μm pitch) before and after different cover plate assembly protocols. The blue-dash line represents the slit depth following thermal fusion bonding at 107 °C for PMMA and at 130 °C for COC slits; red-solid line is the depth of the slits following thermal fusion bonding at 87 °C and 115 °C of an oxygen plasma treated substrate and cover plate for PMMA and COC, respectively; and the black-circle line is the nanoslits following molding, but not subjected to thermal fusion bonding. Reprinted with permission from Chantiwas et al. (2010).59