Table 2.

Nanochannels/nanoslits fabricated in various polymeric materials along with the characteristic geometry of the structures and their reported application

Material	Dimension (nm, width × depth)	Fabrication method	Application	Reference
PDMS	690 × 80	Crack-induced tunable	λDNA stretching	Huh et al. (2007)165
PDMS	7 × 103 nm2 (area)	Tunnel cracking	Nanoparticle trapping	Mills et al. (2010)166
PDMS	1470 × 275	Wrinkle induced by oxygen plasma	Protein preconcentration	Seok et al. (2008)257
PDMS	100, 500 (depth)	Deformation of thin PDMS	DNA stretching	Park et al. (2009)171
PDMS	200 × 60	Collapse of micron-scale PDMS microchannels. Glass/PDMS bonding substrate	DNA elongation and surface enhanced Raman detection of nucleic acids	Park et al. (2009)172
PDMS	400 × 20	Nanochannels cracked from PS petri-dish induced by ethanol	Ion selective enrichment	Xu et al. (2010)37
PMMA	200 × 2000	Proton beam writing, thermal fusion bonding	NA	Shao et al. (2006)188
SU-8, SiO2 layer	250 × 250	EBL and NIL, thermal fusion bonding	DNA stretching	Thamdrup et al. (2008)159
PMMA, COC, PC	3000/7000 × 100	Nanomolding replication, NIL, oxygen plasma treatment with thermal fusion bonding	λDNA transport dynamics and DNA mobilities	Chantiwas et al. (2010)59
PMMA	300 × 500, 300 × 140 and 75 × 120	Imprinting nanostructure from Si etched into PMMA thin film	DNA stretching	Guo (2004)134
PMMA	10 000 × 80	Si molding with thermal fusion bonding	NA	Abgrall et al. (2007)191
PC	100-900 wide, 200 nm wire	Hot embossing of silica nanowire molding with PC substrate, PDMS for cover plate bonded material	NA	Zhang et al. (2008)194
PMMA	185 × 85	Replication of polymer stamp and polymer nanofluidic channels by NIL using polymer stamp	NA	Wu et al. (2010)196
PI (Polyimide)	2000-30 000 wide, 100 and 500 nm deep	Spin coat PI onto Si wafer and deposition of Al as sacrificial layer; etch Al, deposit another layer of PI and remove patterned Al	EOF measurements	Eijkel et al. (2004)203